Motherboard vendor Biostar has added support for the unannounced AMD Ryzen 9 3900 and AMD Ryzen 9 Pro 3900 processors for its X470NH motherboard, revealing some specs along the way.

The Ryzen 9 3900 and Ryzen 9 Pro 3900 made their first appearance in an Eurasian Economic Commission (EEC) listing back in July. Today, Biostar has shed some light on the processors' specifications. As with any third-generation Ryzen chips, the Ryzen 9 3900 and Ryzen 9 Pro 3900 utilize AMD's advanced Zen 2 microarchitecture and are built on TSMC's 7nm FinFET process node.

Specs


The Ryzen 9 3900 and Ryzen 9 Pro 3900 look like they're essentially more power-efficient variants of the original AMD Ryzen 9 3900X. The "Pro" variant comes with enhanced enterprise and security features. Both Matisse chips are expected to weird 12 cores, 24 threads and 70MB of total cache. However, the Ryzen 9 3900 and Ryzen 9 Pro 3900 will compete in the 65W TDP (thermal design power) category against the Intel Core i9-9900. Obviously, the lower TDP envelope will have repercussions on the processors' operating clock speeds.

As per Biostar's information, the Ryzen 9 3900 and Ryzen 9 Pro 3900 sport a 3.1 GHz base clock, which is 700 MHz or 22.58% slower than the Ryzen 9 3900X. The motherboard manufacturer didn't list the processors' boost clocks. However, a well-known hardware leaker known on Twitter as TUM_APISAK seems to think that the boost clock for the Matisse parts can be 4.3 GHz. So we're looking at a 9.52% lower boost clock in a worst-case situation.

It's unknown when AMD will launch the Ryzen 9 3900 and Ryzen 9 Pro 3900. The chipmaker is probably busy building up stock for the Ryzen 9 3950X, which has been pushed to November, and preparing the Ryzen Threadripper 3000-series release. On top of that, TSMC is reportedly in a bit of a pickle. The foundry's 7nm business has been booming lately, and high demand has increased the lead time from 2 months to 6 months. This could have an impact on AMD's CPU production.