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AMD Financial Analyst Day 2020: CPU and GPU Roadmaps, X3D Die Stacking Revealed
AMD held its Financial Analyst Day 2020 today to update the investment community on both the current state of the company and its future plans. The livestream ran from 1:00pm PT to 6:00pm, and there were plenty of exciting announcements during the course of the event, including new roadmaps for Zen 3 and Zen 4 processors, with Zen 3-based processors first arriving for the consumer market in 2020. AMD will flesh out the remainder of the Zen 3 Ryzen product stack by the end of 2021.
AMD also shared a more complete data center roadmap that includes the 7nm EPYC Milan processors that will debut by the end of 2020, and 5nm EPYC Genoa processors that come to market by the end of 2022.
AMD also revealed that Navi 2X and Navi 3X will come with RDNA2 and RDNA3 architectures, respectively. AMD says RDNA 2 GPUs will boost performance per watt by 50% over the first-gen RDNA architecture and come to market in 2020.
We also learned that AMD will debut its new X3D chip stacking architecture that enables scaling in the third dimension, along with a new Infinity Architecture that ties GPUs and CPUs together using a cache-coherent protocol. Finally, we also learned more about the company's big wins for the exascale-class Frontier and El Capitan supercomputers.
We've included a video of the live stream below, but also added our own commentary below and the relevant slides as the event progressed.
AMD CEO Lisa Su took to the stage and said the company would provide an overview of its past accomplishments and then include updates to its plans for the next three to five years. Su noted that the company improved its client market share by eight percentage points overall, an accomplishment that spans eight straight quarters of growth. Su also touted the company's progress in the enterprise market by doubling the number of available server platforms, with more than a 140 scheduled for this year. Su also reminded us that the company has won two exascale supercomputer wins with Frontier and El Capitan.
Su updated the company's total addressable market (TAM) figures. AMD estimates it has a $79 billion TAM overall, split up with $35B for the data center, $32B for PCs, and $12B for gaming.
ADM shared a new roadmap for CPUs and GPUs. We see that the company will have Zen 4 processors based on the 5nm process in-market by the end of 2022. In the interim, we'll get Zen 3 on 7nm, presumably an enhanced "+" type revision. AMD later shared that it will use TSMC's N7+, which uses EUV for several layers.
On the GPU side, we'll see RDNA 3 land by the end of 2022 on an unspecified "advanced node," with RDNA 2 on 7nm arriving in the interim.
Su teased us with a new 3D die-stacking technique called X3D die stacking. She promised more details will come soon during the live stream. This appears to be an answer to Intel's Foveros 3D stacking.
Su also mentioned a new Infinity Architecture, which is a system-level approach to tying together AMD's CPUs and GPUs. We covered this Infinity Fabric 3.0-driven approach in this recent article.
AMD says that Milan is on-track for a 2020 launch, and that it is creating the CDNA branding for its data center GPUs. In the future, AMD will develop the RDNA architecture for the gaming market, and CDNA (Compute DNA) graphics architectures for the data center.
AMD CTO Mark Papermaster has taken the stage for a breakdown on the tech.
